CHE 323, The University of Texas at Austin


Chemical Processes for Micro- and Nanofabrication

Instructor: Chris Mack

Course Objective: The objective of this course of study is to provide students with a glimpse into the semiconductor industry that has been the foundation upon which the electronics industry has been based for the past half century, and to provide insight into the future of that industry as well as nanotechnology in general. In the last 50 years, the dimensions of the features built into integrated circuits have shrunk from 25 mm to 25 nm. Over the next decade these features will approach atomic dimensions, giving rise to a host of unique nanotechnology challenges and opportunities.

Topics Covered: The definition and description of the terminology and processes of microelectronics; semiconductor facilities and chemical processes for integrated circuit manufacture with an emphasis upon unit processes; the major unit processes including thin-film metal and dielectric deposition and etching, silicon oxidation and etching, ion implantation, diffusion, lithography, and planarization; an overview of promising nanopatterning and nanofabrication techniques, such as electron and other particle-beam imaging, nanoimprint, and near-field probe imaging.

Syllabus: CHE323_384 Syllabus_15.pdf

Text: Fabrication Engineering at the Micro- and Nanoscale, 4th ed, by S. A. Campbell

Texbook Errata: Some errors I found while teaching out of this book

Introduction video lecture (4 min): click here.


Course materials and video lectures: click here.

The video lectures were recorded in 2013 and probably won't change frequently. Other materials will likely change each year. (Note that some students have told me they like watching these lectures at 1.5X speed. But am I more interesting at 1.5X speed?)


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