Lithography: How Slow Can We Go?

Moore’s Law has always been about economics: if we follow the trend of Moore’s Law, we can reduce the cost per function for our integrated circuits, making chips more powerful for the same cost, or making chips of a given capability cheaper. Historically, cost per function has decreased by about 29% per year, corresponding to a factor of 2 decrease in cost every two years. There are signs that this historic cost reduction trend will slow down. How much of a slowdown can our industry tolerate? If the cost per function is expected to decrease by less than 10% per year going forward, it is unlikely that chipmakers will be willing to invest the massive amounts required for a new generation of fabs. I suspect that the minimum cost per function decrease we can live with is about 15% per year.

What does this say about lithography costs and capabilities per technology node? The cost/function of a chip is the ratio of the cost/area of finished silicon from making the chip and the functions/area that the technology node can deliver. Over the last decade we have been on a 2-year technology shrink schedule, so that the functions/area double every two years. Thus, by keeping the cost/area constant, we have been able to reduce cost/function by 29% per year. If we stay on the same 2-year shrink cycle, a minimum allowed 15% cost/function decrease per year would allow a maximum of 20% increase in the cost/area of silicon each year. Alternately, if we keep the cost/area of silicon constant, we could slow down the 2-year technology node shrink cycle to 4 years between technology nodes, and still get the required 15% reduction in cost/function per year.

Of course, everyone in the semiconductor industry would love to stay on our historic trends: constant cost/area of finished silicon, and a two year cycle of doubling the functions/area. It seems unlikely that this trend can be maintained during the current decade, however. Thus, using a minimum allowed cost/function decrease of 15%/year as a target, we can either allow chipmaking costs/area to increase by 20% each year and stay on the 2-year technology node cycle, or we can allow our technology node cycle to slow to every four years while keeping manufacturing costs/area constant. Either option will allow for continued success, and probably a bit of growth, for the semiconductor industry. But if the technology shrinks come too slowly, or costs rise too quickly, the days of Moore’s Law will be numbered.

One thought on “Lithography: How Slow Can We Go?”

  1. Chris,
    Thanks for the cheerful note this morning! Of course I have been reaching the same conclusion and trying to design my career trajectory accordingly.

    The cost per bit cannot and will not go up for memory. I suspect this means no direct write or EUV for memory.

    In logic things are a little more complex. Performance/power adds a real subtlety. Also, you didnt mention design costs. I worry that is becoming a dominant factor in much of our industry and is exponentially scaling in the wrong way. This will also slow the technology cadence.

    I think logic IC products maybe able to tolerate a slower than 4 year technology cadence if the design costs can be kept in check. The "trump" card of Moore’s law will be gone and designers will be forced to get more creative with a more slowly increasing transistor budget. Function can be increased with a fixed transistor budget but it takes more design work. That design work must be “cheap.”

    Thanks again for your insightful blog.
    Cyrus

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